This module is a dedicated satellite communication module for GEESATCOM. It integrates the GEESATCOM satellite communication chip, power amplifier, low-noise amplifier, and other functional units. Utilizing a stamp-hole packaging method compatible with mainstream satellite communication modules, it offers high integration, low power consumption, and a built-in power management circuit. Only minimal external circuitry is required to quickly enable satellite communication functionality, making it convenient for rapid integration and design of satellite communication products.
1.Supports GEESATCOM satellite communications
2.Integrates satellite communication chipset, power amplifier, low-noise amplifier, and other functional units
3.Operating temperature:‒40°C to +85°C
4.Low-power design with an average power consumption of 300mW and peak power≤10W
5.Dimensions:30mm×35mm×3.5mm, LCC package
Automotive Electronics
Industrial Applications